Rigid / HDI PCB
Rigid Board
Layer: 4 layer
Board Thickness: 1.5mm
Surface finished: ENIG2u”
Skyblue Soldermask
Test PCB
Material: FR4 TG170
Thickness: 1.0mm
Green Soldermask
IS400 Hard gold fingers 30u”
Layer：10 layer Thickness：1.55mm Material：FR4 TG150，IS400 Surface finished：ENIG 2U”+ Gold finger 20U” Line width/space: 4/4mil, Special process： Vias fill with resin Press-fit holes, Paragraphing Gold finger
Rogers+FR4
Layer: 6 layer
Thickness: 1.6mm
Material: Ro4350B+FR4
Surface finished: ENIG2u”
Grey Soldermask PCB
Layer: 6 layer
Thickness: FR4
Surface finished: 1oz finished copper
grey soldermask
FR4 Black core PCB
Layer：2 layer
Thickness：1.6mm
Material：FP4 Black Core
Surface finished: Gold plating 5U’’
Heavy Copper
Layer：12 layer
Thickness：3.73mm
Material：FR4 TG170
Surface finished: ENIG 2U”
2/3/3/3/3/3/3/3/3/3/3/2oz finished copper
Skyblue soldermask
Ro4003C
Layer：2 layer
Thickness：0.8mm
Material： Rogers 4003C
Surface finished: ENEPIG2u”
ENEPIG PCB
Layer：6 layer
Thickness：1.9mm
Material：FR4 IT180
Surface finished: ENEPIG2u”
2oz finished
FR4 Nanya NPG150
Layer：8 layer
Thickness：1.6mm
Material： FR4 NPG150
Surface treatment: Immersion Gold
Surface finished: ENIG 2U’’
Press fit
FR4 TU-872 SLK
Layer：10 layer
Thickness：1.6mm
Material： FR4 TU-872 SLK
Surface finished: ENIG2u”+Hard gold fingers 50u”
FR4 TG180 TU-862 HF
Layer：8 layer
Thickness：1.6mm
Material： FR4 TG180 TU-862 HF 1.5/1/0.5/1/1/1/1/1.5
Surface finished: ENIG
Blind and Buried holes L1-L2/L7-L8 L2-L3 0.1mm
