CAPABILITY LIST

Capability Process(2021.01)
Series Item Specifications
1 Number of layer Standard FR4 High TG 1-50 L (>=10 L must use High TG)
2 Product Type mechanical blind buried hole, thick copper, semiconductor test board
Multi-laminated blind buried hole laminate for same side≤4 time
HDI 1+N+1, 2+N+2,3+N+3
High Frequency Rogers series, Taconic series, Arlon series, Nelco series, F4BK, TP series
Mixed lamination Rogers+FR4
Rigid-flex ≤20L
FPC ≤10L
metal material copper material, AL material
3 Surface Treatment Surface Treatment HAL, HAL/LF, Enig, Immersion Silver, Immersion Tin, OSP, ENIPIG, Plating hard gold,

Gold finger (contain segmented golden finger), Enig+OSP, Enig+gold finger,

Immersion Tin+gold finger, Immersion Silver+gold finger

4 Board thickness Board thickness 0.2-6.0mm
5 Finished Copper

Thickness

Outer Layers(max) 20OZ
Inner Layers(max) 10OZ
6 Line width/space Min line width/space 3/3mil
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