CAPABILITY LIST
| Capability Process(2021.01) | |||
| Series | Item | Specifications | |
| 1 | Number of layer | Standard FR4 High TG | 1-50 L (>=10 L must use High TG) |
| 2 | Product Type | mechanical blind buried hole, thick copper, semiconductor test board | |
| Multi-laminated blind buried hole | laminate for same side≤4 time | ||
| HDI | 1+N+1, 2+N+2,3+N+3 | ||
| High Frequency | Rogers series, Taconic series, Arlon series, Nelco series, F4BK, TP series | ||
| Mixed lamination | Rogers+FR4 | ||
| Rigid-flex | ≤20L | ||
| FPC | ≤10L | ||
| metal material | copper material, AL material | ||
| 3 | Surface Treatment | Surface Treatment | HAL, HAL/LF, Enig, Immersion Silver, Immersion Tin, OSP, ENIPIG, Plating hard gold,
Gold finger (contain segmented golden finger), Enig+OSP, Enig+gold finger, Immersion Tin+gold finger, Immersion Silver+gold finger |
| 4 | Board thickness | Board thickness | 0.2-6.0mm |
| 5 | Finished Copper
Thickness |
Outer Layers（max） | 20OZ |
| Inner Layers（max） | 10OZ | ||
| 6 | Line width/space | Min line width/space | 3/3mil |
